Residual stress and microstructure analyses of Molybdenum and CuInS2

by Diana Thomas (MAX IV Laboratory | Lund University)

Monday 3 Mar 2014, 10:00 → 11:00 Europe/Berlin

Geb. 25b | Raum 235 (DESY Hamburg)

Time-resolved investigations of the evolution of residual stress and
microstructure within Molybdenum and CuInS2 thin films during heat
treatment will be presented. In situ residual stress analysis was
realized by a novel two-detector EDXRD (energy dispersive X-ray
diffraction) set-up, which uses high intensity, polychromatic
synchrotron radiation. The residual stress evolution during annealing
can be described as a superposition of intrinsic stresses and thermal
stresses, respectively. The intrinsic stresses are a direct consequence
of the layer structure and deposition conditions, while the thermal
stresses are caused by the difference in coefficients of thermal
expansion between the substrate and layer. Additional information about
microstructure and crystallographic texture of the sample were obtained
and will be shown in the talk.