Engineering Seminar: Thin Films Mechanical Stability and Fracture Prevention

by Alex Volinsky, University of South Florida

Friday 9 Jul 2010, 14:00 → 15:00 Europe/Berlin

AER 19, Room 3.11 (European XFEL)

Thin films can serve different functions, but in most applications good film adhesion is required. Thin films and coatings are subjected to stress with temperature fluctuations due to the difference in thermal expansion coefficient of the film and the substrate. This stress is unavoidable, and in some cases can cause fracture. Films can either crack and/or delaminate from the substrate, which in most cases makes the system inoperable, or significantly reduces its life. Several examples of system failures will be considered, both in tension and compression. Recommendations for the safe design will be made based on the mechanics of thin films.