TTC Meeting at SLAC, December 1 - 4, 2015

Cryomodule Development & Integration Experience: Essential factors for improving reliability in cryomodule assembly

1 Dec 2015, 14:25

15m

Building 48, Redwood ABCD (DESY Hamburg)

WG 3 : Cryomodule - Conveners: E. Harms (FNAL), H. Nakai (KEK), J. Preble (Jlab), S. Berry (CEA) (30 minutes Coffee Break incl.)

Speaker

thierry Trublet (CEA Saclay)

Presentation materials

Slides

reliability_improvement_of_XFEL_crymodule_assembly_-_TTC_2015_V3.pptx