31 January 2017 to 2 February 2017
GSI Darmstadt
Europe/Berlin timezone

Flip-Chip Bonding at DESY: Experiences & Outlook

31 Jan 2017, 18:54
3m
Main Lecture Hall (GSI Darmstadt)

Main Lecture Hall

GSI Darmstadt

Speaker

Mrs Sumera Kousar (FEC DESY)

Description

-Solder Jetting -Flip-Chip Bonding -Limits & Flexibilities -CMS BPix & DTS SiPM

Topic (ARD or DTS)

DTS

Primary author

Mrs Sumera Kousar (FEC DESY)

Co-authors

Mrs Inge Diehl (DESY) Dr Karsten Hansen (DESY)

Presentation materials