Timepix4 is a versatile readout chip with 55 µm pixels, recently developed by CERN on behalf of the Medipix4 collaboration. It can operate both in a photon counting mode with frame readout, and a timestamping mode with event readout. Both of these modes offer higher performance than existing Medipix3 and Timepix3 chips. This makes Timepix4 appealing to a wide range of X-ray experiments at synchrotrons.
At DESY, a new readout system is being developed that is designed to cope with the chip’s high readout bandwidth (up to 162 Gbps per chip). Firstly, a single chip carrier board has been designed, produced and tested. In the long term, multi-megapixel systems composed of multiple chips will be developed. New detector head boards and also custom readout boards will be needed. Furthermore, recent developments on Through Silicon Via (TSV) technology will make it possible to operate the chip without wire bonds, thus greatly reducing the dead gaps between modules.