TTC 2022, TESLA Technology Collaboration

HiPIMS Nb on seamless Cu substrates: different ways to fabricate seamless substrates, and their results in a vertical cryostat, L. Vega Cid (CERN)

26 Jan 2022, 16:00

20m

WG2

Presentation materials

Lorena_20220127_TTC2022.pptx