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Topical workshop on Bonding Technologies for Interconnect¶

Name: Topical workshop on Bonding Technologies for Interconnect¶
Start: 2022-03-17T13:30:00+01:00
End: 2022-05-17T17:30:00+02:00
Location: Zoom

17 Mar 2022, 13:30 → 17 May 2022, 17:30 Europe/Berlin

Zoom

Description

A 'technology focus' more in-depth seminar on various aspects of bump- and wire-bonding. From basics for graduate students and postdocs to updates on newest
methods & possibilities

Link to the meeting: https://indico.scc.kit.edu/event/2678/

The agenda of this meeting is empty