Topical workshop on Bonding Technologies for Interconnect¶

17 Mar 2022, 13:30 → 17 May 2022, 17:30 Europe/Berlin

Zoom

A 'technology focus' more in-depth seminar on various aspects of bump- and wire-bonding. From basics for graduate students and postdocs to updates on newest
methods & possibilities

 

Link to the meeting: https://indico.scc.kit.edu/event/2678/