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08:30
Copper plating specifications, XFEL, LCLS-II, KEK, ERL Cornell, CERN
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Wolf-Dietrich Möller
(DESY)
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08:45
Copper plating methods
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Sergio Calatroni
(CERN)
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08:55
Thermal simulations, pulsed CW, XFEL, others
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Denis Kostin
(DESY)
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09:05
Investigation methods, destructive and non-destructive
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Alexey Ermakov
(DESY)
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09:15
Real defects, examples, classification at XFEL
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Walid kaabi
(LAL)
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09:25
Experience with defects in copper plating at HTS (SLAC/CPI/FNAL ILC collaboration)
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Kenneth Premo
(Fermilab)
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09:35
Method and experience of copper plating at Toshiba
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Osamu Yushiro
(Toshiba)
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09:45
Copper plating issues at Cornell
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Vadim Veshcherevich
(Cornell Univrsity)
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09:55
QC during mass production - Discussion
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Wolf-Dietrich Möller
(DESY)
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10:40
XFEL coupler
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Walid kaabi
(LAL)
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10:50
KEK-cERL, ML coupler
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Hiroshi Sakai
(KEK)
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11:00
TTF3-SLAC/FNAL coupler
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Kenneth Premo
(Fermilab)
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11:10
SPIRAL2 coupler
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Yolanda GOMEZ MARTINEZ
(LPSC / IN2P3)
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11:20
What is the best preparation procedure? Discussion...
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Eiji Kako
(KEK)
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11:30
Coupler design: TTF-3 coupler modification for LCLS-II CW
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Nikolay Solyak
(Fermilab)
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12:00
CW coupler for BerlinPro/HZB
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Vasim Khan
(Helmholtz Zentrum Berlin)
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12:10
CW coupler for Cornell ERL
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Vadim Veshcherevich
(Cornell Univrsity)
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12:20
ESS coupler design
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Stephen Molloy
(ESS)