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8:30 AM
Copper plating specifications, XFEL, LCLS-II, KEK, ERL Cornell, CERN
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Wolf-Dietrich Möller
(DESY)
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8:45 AM
Copper plating methods
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Sergio Calatroni
(CERN)
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8:55 AM
Thermal simulations, pulsed CW, XFEL, others
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Denis Kostin
(DESY)
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9:05 AM
Investigation methods, destructive and non-destructive
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Alexey Ermakov
(DESY)
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9:15 AM
Real defects, examples, classification at XFEL
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Walid kaabi
(LAL)
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9:25 AM
Experience with defects in copper plating at HTS (SLAC/CPI/FNAL ILC collaboration)
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Kenneth Premo
(Fermilab)
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9:35 AM
Method and experience of copper plating at Toshiba
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Osamu Yushiro
(Toshiba)
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9:45 AM
Copper plating issues at Cornell
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Vadim Veshcherevich
(Cornell Univrsity)
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9:55 AM
QC during mass production - Discussion
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Wolf-Dietrich Möller
(DESY)
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10:40 AM
XFEL coupler
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Walid kaabi
(LAL)
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10:50 AM
KEK-cERL, ML coupler
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Hiroshi Sakai
(KEK)
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11:00 AM
TTF3-SLAC/FNAL coupler
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Kenneth Premo
(Fermilab)
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11:10 AM
SPIRAL2 coupler
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Yolanda GOMEZ MARTINEZ
(LPSC / IN2P3)
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11:20 AM
What is the best preparation procedure? Discussion...
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Eiji Kako
(KEK)
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11:30 AM
Coupler design: TTF-3 coupler modification for LCLS-II CW
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Nikolay Solyak
(Fermilab)
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12:00 PM
CW coupler for BerlinPro/HZB
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Vasim Khan
(Helmholtz Zentrum Berlin)
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12:10 PM
CW coupler for Cornell ERL
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Vadim Veshcherevich
(Cornell Univrsity)
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12:20 PM
ESS coupler design
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Stephen Molloy
(ESS)