First MT Student Retreat

Gold-stud bump bonding - Interconnection technology for research and development of new detectors

23 Feb 2015, 14:36

23m

Sem Room 4 (DESY Hamburg)

Session 1

Speaker

Simon Kudella (Karlsruhe Institute of Technology (KIT); Institut für Experimentelle Kernphysik (IEKP), Institut für Prozessdatenverarbeitung und Elektronik (IPE))

Presentation materials

Slides

Gold-stud_bumping_short.avi

MT_gold-stud_bump_bonding_english_final.pdf