Speakers
Description
Using the example of the future ALICE vertex detector (ITS3),
this talk aims at providing an overview on cutting-edge developments at
the front of Monolithic Active Pixel Sensors (MAPS). These CMOS pixel
sensors offer mechanical flexibility and a low power consumption, while
maintaining excellent hit detection efficiency and spatial resolution.
Featuring wafer-scale, stitched sensors, which are bent to form a truly
cylindrical detection layers, the ITS3 concept pushes the limits in terms
of detection performance, while dramatically reducing the material budget.
Introducing the novel detector concept, via the characterisation of small-scale
pixel sensor prototypes produced in the 65 nm CMOS technology node, to first
results of large-area, stitched sensors, milestones of the ITS3 development are presented.
Here, the focus will be on the detection performance and power consumption
of the prototypes as well as in-beam characterisation of large-scale sensors.
Furthermore, the technique of material budget imaging is used to investigate
the scattering properties of a light-weight tracking detector mock-up.
